Abstract
With the continuous advancement of technology and the increasing market demand, large-area production has become a goal; fan-out panel-level packaging(FO-PLP) has been selected as a solution to these challenges. However, during the process, mismatches in the coefficients of thermal expansion between different materials can lead to substantial warpage behavior, reducing the reliability and yield of the packaging. This study establishes a 320mm x 320mm three-dimensional(3D) model using the Finite Element Method (FEM) combined with Process Modeling technology to analyze the warpage behavior in FO-PLP during the process, including the effects of different temperature loads during compression molding, Post Mold Cure (PMC) and debonding processes. Epoxy molding compound, used as a protective structure in the packaging, is discussed and compared to the viscoelastic and viscoplastic models. The viscoelastic model considers time-dependent mechanical properties and elastic recovery, effectively describing the deformation behavior of the epoxy molding compound. However, the viscoplastic model is more suitable for accurately predicting the behavior of real materials. To verify the feasibility of the epoxy resin viscoplastic material model, this study conducts numerical validation with experimental test vehicles. By constructing a large panel model consistent with the experimental dimensions and specific temperature load conditions, warpage values are predicted and compared with experimental values, achieving good matching results. This establishes the usability of the viscoplastic model for subsequent use.