- Title
- Evolution of Morphology and Microstructure on Ameliorated Electroplated Ni-Zn and Ni-Fe Films for Under Bump Metallization Application
- Creators - without role
- H. M. LinJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- E-MRS 2012 Spring Meeting E-MRS 2012 Spring Meeting
- Identifiers
- 9957771846306774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Evolution of Morphology and Microstructure on Ameliorated Electroplated Ni-Zn and Ni-Fe Films for Under Bump Metallization Application
E-MRS 2012 Spring Meeting E-MRS 2012 Spring Meeting
2012
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