- Title
- Evolution of reliability on electroplated and sputtered Ni-Zn films for under bump metallization with Sn-3.0Ag-0.5Cu solder attached during liquid reactions
- Creators - without role
- H. M. LinJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Identifiers
- 9957776301506774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- TACT 2011 International Thin Films Conference TACT 2011 International Thin Films Conference
Conference paper
Evolution of reliability on electroplated and sputtered Ni-Zn films for under bump metallization with Sn-3.0Ag-0.5Cu solder attached during liquid reactions
TACT 2011 International Thin Films Conference TACT 2011 International Thin Films Conference
2011
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