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Experimental and numerical analysis of thermal deformation in thermoelectric coolers
Conference paper

Experimental and numerical analysis of thermal deformation in thermoelectric coolers

Wei-Chung Wang and Ting-Ying Wu
Applied Mechanics and Materials, Vol.70, pp.399-404
2011

Abstract

Electronic Speckle Pattern Interferometry Finite Element Method Thermal Deformation Thermoelectric Cooler
In this paper, the electronic speckle pattern interferometry (ESPI) and the finite element method (FEM) were used to obtain the thermal deformation induced in a centrally supported thermoelectric cooler (TEC). The results of ESPI and FEM are in good agreement and show that the warpage varies linearly with respect to the temperature difference between the two ceramic plates inside the TEC. © (2011) Trans Tech Publications, Switzerland.

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