Experimental characterization and mechanical behavior analysis on intermetallic compounds of 96.5Sn-3.5Ag and 63Sn-37Pb solder bump with Ti-Cu-Ni UBM on copper chip

Chih-Tang Peng; Chia-Tai Kuo; Kuo-Ning Chiang; Terry Ku; Kenny Chang

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Conference paper

Experimental characterization and mechanical behavior analysis on intermetallic compounds of 96.5Sn-3.5Ag and 63Sn-37Pb solder bump with Ti-Cu-Ni UBM on copper chip

Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku and Kenny Chang

Proceedings - Electronic Components and Technology Conference, Vol.1, pp.90-97

2004

Abstract

Intermetallic compounds

Isothermal aging

Lead-free

Sn-Ag solder

Sn-Pb solder

UBM

The experimental characterization and mechanical behavior analysis on intermetallic compounds of 96.5Sn-3.5Ag and 63Sn-37Pb solder bump with Ti-Cu-Ni UBM on copper chip was studied. The study of shear displacement rate-effect on the solder bump strength indicates that the analysis of bump strength versus thermal aging time should be identified as a qualitative analysis for solder bump strength determination rather than a quantitative one. The larger the UBM size, the higher the solder bumps shear strength, and there was no significant influence on intermetallic compound formation mechanism for both lead-containing and lead-free materials. The UBM size and solder volume show no distinct difference in the trend of strength degradation of solder bumps.

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Title: Experimental characterization and mechanical behavior analysis on intermetallic compounds of 96.5Sn-3.5Ag and 63Sn-37Pb solder bump with Ti-Cu-Ni UBM on copper chip
Creators - without role: Chih-Tang Peng - Dept. of Pwr. Mechanical Engineering , National Tsing Hua University , VIA Technology Corporation
Chia-Tai Kuo - Dept. of Pwr. Mechanical Engineering , National Tsing Hua University , VIA Technology Corporation
Kuo-Ning Chiang - Dept. of Pwr. Mechanical Engineering , National Tsing Hua University , VIA Technology Corporation
Terry Ku - Dept. of Pwr. Mechanical Engineering , National Tsing Hua University , VIA Technology Corporation
Kenny Chang - Dept. of Pwr. Mechanical Engineering , National Tsing Hua University , VIA Technology Corporation
Publication Details: Proceedings - Electronic Components and Technology Conference, Vol.1, pp.90-97
Identifiers: 9957766616206774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Conference paper

Experimental characterization and mechanical behavior analysis on intermetallic compounds of 96.5Sn-3.5Ag and 63Sn-37Pb solder bump with Ti-Cu-Ni UBM on copper chip

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