Abstract
A heat pipe device based on enhanced condensation and high driving Laplace pressure in extended-nano space (10 -10 nm scale) is developed for a non-electric cooling. A vacuum system was specifically designed and established for our integrated heat pipe device. Compared to the working in ambient air, the extended-nano heat pipe is verified for proper working with higher flow rates in a vacuum environment for the first time. The cooling performance is evaluated quantitatively. Although the performance is still very low, higher performance is expected for cooling hot spots in large scale integration (LSI) by optimization of nanofabrication.