Abstract
To overcome the severe challenges of achieving an extra-thin thickness down to 10 μm for chip stacking of 3D-IC module such as the mechanical damages appear at chip grinding, subsequent steps of wafer handling, and robust assembly, a novel pre-molding technology applied to assembled stacked module prior to chip thinning procedure is presented in this study. Packaging vehicle is fabricated to demonstrate the feasibility of proposed approach. Moreover, failure estimation and mechanical reliability are also implemented by using a 3D nonlinear finite element analysis.