Fabrication of Nano-twinned Ni Films as Novel under Bump Metallization on Electronic Packaging via Sputter Coating

Conference paper

40th International Conference on Metallurgical Coating and Thin Films 40th International Conference on Metallurgical Coating and Thin Films

2013

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Title: Fabrication of Nano-twinned Ni Films as Novel under Bump Metallization on Electronic Packaging via Sputter Coating
Creators - without role: Y. H. Wu
J. G. Duh - 國立清華大學工學院材料科學工程學系
Publication Details: 40th International Conference on Metallurgical Coating and Thin Films 40th International Conference on Metallurgical Coating and Thin Films
Identifiers: 9957771124606774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper