Abstract
Fatigue behavior of multi-stacked films type OLED devices under a flexural load been greatly paid attention while the requirement of thinner and more flexible packaging structure. To enhance mechanical reliability of related critical components utilized in foregoing OLED architecture, a mechanical model of multi-layers structure is demonstrated and validated by nonlinear finite element analysis, exploring the impact of several concerned mechanical parameters within a whole OLED packaging. The results indicated that the thickness of PI substrate is a significant parameter to determine the bending stress of indium tin oxide film. It is found that the use of thicker and softer film could be able to reduce the stress of ITO conductive film.