- Title
- Feasibility and Reliability of ENEPIG Surface Finish with Ultrathin Ni(P) Deposit in Microelectronic Packaging
- Creators - without role
- C. Y. HoJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Identifiers
- 9957772937406774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012 Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012
Conference paper
Feasibility and Reliability of ENEPIG Surface Finish with Ultrathin Ni(P) Deposit in Microelectronic Packaging
Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012 Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012
2012
Metrics
1 Record Views