Fermi Level Depinning for Metal/Germanium Schottky Junction by CF4 Plasma Treatment

Conference paper

Jia-Rong Wu, Chin-Yao Hou, Min-Lin Wu, Chia-Chun Lin, Lun-Lun Chen and Yung-Hsien Wu

International Conference on Solid State Devices and Materials (SSDM) International Conference on Solid State Devices and Materials (SSDM)

2011

Abstract

Fermi Level;Depinning;Metal/Germanium;Schottky Junction;CF4 Plasma Treatment

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Title: Fermi Level Depinning for Metal/Germanium Schottky Junction by CF4 Plasma Treatment
Creators - without role: Jia-Rong Wu
Chin-Yao Hou
Min-Lin Wu
Chia-Chun Lin
Lun-Lun Chen - National Tsing Hua University
Yung-Hsien Wu - 國立清華大學原子科學院工程與系統科學系
Identifiers: 9957771078306774
Academic Unit: Tsing Hua College, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: International Conference on Solid State Devices and Materials (SSDM) International Conference on Solid State Devices and Materials (SSDM)