Fine Pitch Microbump Assembly of 3D ICs Packages Using Thermo-Compression Approach

Conference paper

2012 ANSYS Taiwan User Conference 2012 ANSYS Taiwan User Conference

2012

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Title: Fine Pitch Microbump Assembly of 3D ICs Packages Using Thermo-Compression Approach
Creators - without role: 昌駿李 - 國立清華大學工學院動力機械工程學系
Identifiers: 9957775325106774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: 2012 ANSYS Taiwan User Conference 2012 ANSYS Taiwan User Conference