Abstract
The Anand constitutive model is frequently utilized to explain the mechanical characteristics of solder materials in electronic components. In the Anand model, plasticity and creep are integrated and governed by a unified set of flow and evolutionary equations. The uniaxial tensile test results of Pb-free SAC305 are applied in this research to obtain the parameters of the Anand model. Due to the complexity of the model equations, it is difficult to determine all the parameters at once. The traditional approach involves using a standard multi-step procedure to estimate the model parameters. The experimental data used in this study were obtained from Motalab et al.[1], and the curve fitting method they employed was the least squares method. An artificial neural network (ANN) based method is applied for the parameter abstraction from the experimental results, with the freedom of initial guessing of these parameters. The framework and the procedure will be described. After completing the initial fitting of the Anand model, we will explore the influence of the specific parameters A, ho, and s 0 on the fitting of the model curve when they are varied across different orders of magnitude. Additionally, we will demonstrate the impact of Anand model with values at different orders of magnitude on the simulation results of finite element models for WLCSP (Wafer Level Chip Scale Packaging).