Abstract
This study presents the monolithic integration of inductive force sensor and thermoelectric infrared (IR) sensor respectively for the applications of touch/touchless sensing (Fig. 1). Based on the standard CMOS technology, post-CMOS processes, and flip-chip bonding, the proposed sensing chip is designed and implemented. Merits of the design are: (1) SoC: to integrate inductive force sensor (for touch-sensing) and IR sensor (for touchless-sensing) on single chip, (2) Flip-chip bonding: to exploit Si-substrate as the housing of polymer-bump contact interface for inductive force sensor [1] and the cover for IR sensor during loading and polymer-filling, Measurements show IR touchless-sensing (with 37mm sensing distance) and force touch-sensing are ultaneously achieved to demonstrate the concept and feasibility of the presented device.