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Fully differential CMOS-MEMS square-plate oxide resonators with embedded poly-silicon electrodes
Conference paper

Fully differential CMOS-MEMS square-plate oxide resonators with embedded poly-silicon electrodes

W.-C. Chen, M.-H. Li, Y.-C. Liu, D. Weinstein, W. Fang and S.-S. Li
2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013, pp.2292-2295
2013

Abstract

CMOS-MEMS Composite Fully-Differential Micromechanical Resonator RF-MEMS Square-Plate Hardware and Architecture,Electrical and Electronic Engineering
A fully differential CMOS-MEMS square-plate oxide (SiO <sub>2</sub> ) resonator with embedded polysilicon (PolySi) electrodes fabricated using a conventional 0.35 μm CMOS process has been demonstrated with Q > 4,000 and motional impedance R <sub>m</sub> of 67.3 KΩ at 6.89 MHz. The key to attaining such performance involves leveraging high-Q materials such as SiO <sub>2</sub> and PolySi available from the CMOS back-end-of-line stacks. The composite SiO <sub>2</sub> /PolySi structure also facilitates the electrical routing for a fully differential drive/sense configuration to suppress capacitive feedthroughs. In addition, the combination of large transduction areas and high-Q flexural-plate mode from the square-plate resonator significantly reduces R <sub>m</sub> as compared to our previously developed CMOS-MEMS resonators. This technology paves a way toward monolithically integrated CMOS-MEMS oscillators and filters for future single-chip transceivers in wireless communications. © 2013 IEEE.

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