GA-NN and Explainable AI for IC Packaging Warpage Optimization: A Case Study on Product Feature

Conference paper

Yan-Cheng Lin, Tang-Yuan Chen, Chen-Chao Wang, Chin-Pin Hung, I-An Shou and 宏鍇王

IEEE 75th Electronic Components and Technology Conference

2025

Abstract

GA-NN;Explainable AI

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Title: GA-NN and Explainable AI for IC Packaging Warpage Optimization: A Case Study on Product Feature
Creators - without role: Yan-Cheng Lin
Tang-Yuan Chen
Chen-Chao Wang
Chin-Pin Hung
I-An Shou
宏鍇王
Publication Details: IEEE 75th Electronic Components and Technology Conference
Identifiers: 9957767723106774
Academic Unit: Executive Cross-Discipline Master Program for Intelligent Manufacturing, Office of Academic Affairs, National Tsing Hua University
Language: English
Resource Type: Conference paper