Abstract
The research employs the finite element method (FEM) to predict and analyze the outcomes of nickel-gold plating. To improve simulation accuracy and computational efficiency, the study proposes a global/local modeling approach to simulate the plating thickness distribution of IC substrate units. Instead of constructing the entire plating bath structure in the model, this method allows for local modeling of regions of interest while preserving the trend of the global model. This approach can accurately predict the thickness distribution. The model can also be applied in broader contexts to optimize products, reduce factory testing times, accelerate production, and improve product quality.