- Title
- Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC Technologies
- Creators - without role
- R. W. SongW. Y. ChenJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- 一〇五年中國材料科學學會年會 一〇五年中國材料科學學會年會
- Identifiers
- 9957777189906774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC Technologies
一〇五年中國材料科學學會年會 一〇五年中國材料科學學會年會
2016
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