Grinding Behavior Analysis and Process Monitoring of Cylindrical Grinding in Lens Centering Using Acoustic Emission Signals

會議論文

Chun-Wei Liu, Tsung-Huan Tsai, Yu-Chen Liang, Shiau-Cheng Shiu Shiu, Hung-Tsai Wu 和 Ta-Hsin Chou

The 27th International Symposium on Advances in Abrasive Technology (Japan, 16/11/2025–19/11/2025)

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題名: Grinding Behavior Analysis and Process Monitoring of Cylindrical Grinding in Lens Centering Using Acoustic Emission Signals
創作者：: Chun-Wei Liu (通訊作者) - 國立清華大學, 動力機械工程學系
Tsung-Huan Tsai (作者) - 國立清華大學, 動力機械工程學系
Yu-Chen Liang (作者) - 國立清華大學, 動力機械工程學系
Shiau-Cheng Shiu Shiu (作者) - 國立清華大學, 動力機械工程學系
Hung-Tsai Wu (作者) - Industrial Technology Research Institute
Ta-Hsin Chou (作者) - Industrial Technology Research Institute
會議: The 27th International Symposium on Advances in Abrasive Technology (Japan, 16/11/2025–19/11/2025)
學術資源類型: 會議論文