- Title
- Heterostructurally integrated III-V semiconductors through wafer-bonding: Interface adhesion and reliability
- Creators - without role
- F. ShiC.F. XuK.L. ChangJ. EppleK.Y. ChengK.C. Hsieh
- Publication Details
- Materials Research Society 2003 Spring Meeting
- Identifiers
- 9957776373806774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Heterostructurally integrated III-V semiconductors through wafer-bonding: Interface adhesion and reliability
Materials Research Society 2003 Spring Meeting
2003
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