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High Thermal Stability of AlCrTaTiZr Nitride Film as Diffusion Barrier for Copper Metallization
Conference paper

High Thermal Stability of AlCrTaTiZr Nitride Film as Diffusion Barrier for Copper Metallization

Shou-Yi Chang and Ming-Ku Chen
Proceedings of ThinFilms 2008 Proceedings of ThinFilms 2008
2008

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