Hybrid Solder Pad System for Enhancing the Reliability of Wafer Level Packaging

Conference paper

C. C. Lee, C. M. Liu and K. N. Chiang

2005 ANSYS Taiwan User Conference 2005 ANSYS Taiwan User Conference

2005

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Title: Hybrid Solder Pad System for Enhancing the Reliability of Wafer Level Packaging
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
C. M. Liu
K. N. Chiang
Publication Details: 2005 ANSYS Taiwan User Conference 2005 ANSYS Taiwan User Conference
Identifiers: 9957767188306774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper