- Title
- INVESTIGATION OF COPPER INTERCONNECTS SUFFERED RELIABILITY PHYSICS FOR ADVANCED PACKAGING ARCHITECTURE
- Creators - without role
- J.-C. Chuang - National Tsing Hua University昌駿 李
- Publication Details
- ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), Vol.10
- Identifiers
- 9957774124306774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- English
- Resource Type
- Conference paper
Conference paper
INVESTIGATION OF COPPER INTERCONNECTS SUFFERED RELIABILITY PHYSICS FOR ADVANCED PACKAGING ARCHITECTURE
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), Vol.10
2024
Appears in keyword about Physics
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