Impact Testing of Sn3.0Ag0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization after Aging at 150 C

Conference paper

K.J. Wang, J.G. Duh, B Sykes and D Schade

TMS 2010 139th Annual Meeting & Exhibition TMS 2010 139th Annual Meeting & Exhibition

2010

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Title: Impact Testing of Sn3.0Ag0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization after Aging at 150 C
Creators - without role: K.J. Wang
J.G. Duh - 國立清華大學工學院材料科學工程學系
B Sykes
D Schade
Publication Details: TMS 2010 139th Annual Meeting & Exhibition TMS 2010 139th Annual Meeting & Exhibition
Identifiers: 9957766439906774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper