Abstract
Effects of Ge oxidation states in GeO x interfacial layer (IL) on electrical characteristics of Ge pMOSFET with ~ 0.5 nm EOT are comprehensively studied. The gate leakage current density (J G ) is impacted by contents of Ge +1 and Ge +2 in GeO x IL. The hole mobility is influenced by content of Ge +3 in GeO x IL. The Ge oxidation states in IL play crucial roles on Ge pMOSFET.