Impact of High Density TSVs on the Assembly of 3D ICs Packaging

Conference paper

C. C. Lee, T. F. Yang, C. S. Wu, K. S. Kao, C. W. Fang, C. J. Zhan, J. H. Lau and T. H. Chen

Materials for Advanced Metallization Conference (MAM 2012) Materials for Advanced Metallization Conference (MAM 2012)

2012

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Title: Impact of High Density TSVs on the Assembly of 3D ICs Packaging
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
T. F. Yang
C. S. Wu
K. S. Kao
C. W. Fang
C. J. Zhan
J. H. Lau
T. H. Chen
Identifiers: 9957774340906774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: Materials for Advanced Metallization Conference (MAM 2012) Materials for Advanced Metallization Conference (MAM 2012)