Impact of New Materials and Designed Structures on 0.18 μm Multilevel Interconnect Technology

Conference paper

Tzu-Kun Ku, Cheng-Kuo Yeh, Chenhsin Lien and Lai-Juh Chen

Semicon Taiwan 1997

1997

Abstract

New Materials;Designed Structures;Multilevel Interconnect Technology

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Title: Impact of New Materials and Designed Structures on 0.18 μm Multilevel Interconnect Technology
Creators - without role: Tzu-Kun Ku
Cheng-Kuo Yeh
Chenhsin Lien - 國立清華大學電機資訊學院電機工程學系
Lai-Juh Chen
Identifiers: 9957775976506774
Academic Unit: College of Electrical Engineering and Computer Science, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: Semicon Taiwan 1997