Impact of Process Variables on Channel Stress and Carrier Mobility for Strained-Si CMOS

Conference paper

Chun-Hsing Shih, Chung-Shen Cheng, Ching-Chang Lin and Chenhsin Lien

International Electron Devices and Materials Symposium, p.373

2006

Abstract

Strained-Si;CMOS

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Title: Impact of Process Variables on Channel Stress and Carrier Mobility for Strained-Si CMOS
Creators - without role: Chun-Hsing Shih
Chung-Shen Cheng
Ching-Chang Lin
Chenhsin Lien - 國立清華大學電機資訊學院電機工程學系
Publication Details: International Electron Devices and Materials Symposium, p.373
Identifiers: 9957769663606774
Academic Unit: College of Electrical Engineering and Computer Science, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper