- Title
- Improved Method for the Thickness Measurements of Intermetallic Compound in the Sn-Ag-Zn Solder Joint
- Creators - without role
- Y. G. LeeC. S. HuangJ. G. Duh - 國立清華大學工學院材料科學工程學系B. S. Chiou
- Identifiers
- 9957777649506774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- IMAPS TAIWAN Technical Symposium 2000 IMAPS TAIWAN Technical Symposium 2000, pp.22-26
Conference paper
Improved Method for the Thickness Measurements of Intermetallic Compound in the Sn-Ag-Zn Solder Joint
IMAPS TAIWAN Technical Symposium 2000 IMAPS TAIWAN Technical Symposium 2000, pp.22-26
2000
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