- Title
- Improvements of Stress Migration in Nano-scaled Copper Interconnects
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系W. C. WangP. C. HuangY. Y. LiouH. N. Liu
- Publication Details
- the 2014 Asian Conference on Nanoscience and Nanotechnology (AsiaNANO 2014) the 2014 Asian Conference on Nanoscience and Nanotechnology (AsiaNANO 2014)
- Identifiers
- 9957770874406774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Improvements of Stress Migration in Nano-scaled Copper Interconnects
the 2014 Asian Conference on Nanoscience and Nanotechnology (AsiaNANO 2014) the 2014 Asian Conference on Nanoscience and Nanotechnology (AsiaNANO 2014)
2014
Metrics
1 Record Views