Induced Thermo-Mechanical Reliability of Copper-Filled TSV Interposer by Transient Selective Annealing Technology

Conference paper

C. C. Lee and C. C. Huang

2014 International Electron Devices and Materials Symposium (IEDMS) 2014 International Electron Devices and Materials Symposium (IEDMS)

2014

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Title: Induced Thermo-Mechanical Reliability of Copper-Filled TSV Interposer by Transient Selective Annealing Technology
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
C. C. Huang
Identifiers: 9957768013906774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: 2014 International Electron Devices and Materials Symposium (IEDMS) 2014 International Electron Devices and Materials Symposium (IEDMS)