- Title
- Influence Estimation of Process-Induced Stress on Flexible Electronics Packaging
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系J. Y. HeC. P. HsiehC. C. TsaiJ. C. Chuang
- Publication Details
- 2017 International Microsystems Packaging Assembly and Circuits Technology Conference (the 12th IMPACT Conference) 2017 International Microsystems Packaging Assembly and Circuits Technology Conference (the 12th IMPACT Conference)
- Identifiers
- 9957773087906774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Influence Estimation of Process-Induced Stress on Flexible Electronics Packaging
2017 International Microsystems Packaging Assembly and Circuits Technology Conference (the 12th IMPACT Conference) 2017 International Microsystems Packaging Assembly and Circuits Technology Conference (the 12th IMPACT Conference)
2017
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