- Title
- Influence of Arrangement Design and Mechanical Property for Molding Material on 3D-ICs Packaging
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系Y. H. GuoB. T. ChianT. C. Chang
- Identifiers
- 9957773256906774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- Proceedings of the 30th National Conference on Mechanical Engineering (CSME) Proceedings of the 30th National Conference on Mechanical Engineering (CSME)
Conference paper
Influence of Arrangement Design and Mechanical Property for Molding Material on 3D-ICs Packaging
Proceedings of the 30th National Conference on Mechanical Engineering (CSME) Proceedings of the 30th National Conference on Mechanical Engineering (CSME)
2013
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