Abstract
This paper presents a inkjet-printed trisection bandpass filter on multilayer LCP, which was developed based on mechanical property of inkjet-printed silver film. A lamination bonding pressure of 0.69 MPa and temperature of 270 °C were used to achieve appropriate adhesiveness. A filter was realized with a S 21 of -1.06 at 10.5 GHz. The bending effect was also observed. The results demonstrated the success of the fabrication technique provides an inexpensive and practicable 3D integration solution.