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Integration of CMOS front-end circuits with silicon photonic devices for high speed PAM-4 optical links
Conference paper

Integration of CMOS front-end circuits with silicon photonic devices for high speed PAM-4 optical links

Shawn S. H. Hsu, Shawn S. H. Hsu, Yan-Feng Li, Hao-Ju Wang, Tai-Chun Chen, Chih-Kuo Tseng, Ming-Chang Lee, Ke Li, David J. Thomson and Graham T. Reed
2017 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2017, pp.250-252
09/2017
DOI: https://doi.org/10.1109/RFIT.2017.8048241

Abstract

CMOS modulator driver (MD) Optical link PAM-4 silicon photonics transimpedance amplifier (TIA) Computer Networks and Communications Electrical and Electronic Engineering Instrumentation
This paper presents our recent studies on CMOS front-end circuits for high speed optical links. The circuit topologies of both transimpedance amplifier (TIA) and modulator driver (MD) are discussed for achieving wideband operation in PAM-4 modulation using advanced CMOS technology. Also, issues of integration of the circuits with silicon photonic devices such as the Ge-on-Si photo diode (PD) and silicon modulator are addressed for high performance silicon-based transceiver front-end of optical link.

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