Logo image
Back
Integration of the fabrication processes and wafer level packaging of MEMS devices using localized induction heating
Conference paper

Integration of the fabrication processes and wafer level packaging of MEMS devices using localized induction heating

HsuehAn Yang, Mingching Wu and Weileun Fang
2003 IEEE/LEOS International Conference on Optical MEMS, pp.22-23
2003
DOI: https://doi.org/10.1109/OMEMS.2003.1233448

Abstract

Heating Hermetic seals Integrated optics Microelectromechanical devices Optical device fabrication Optical devices Optical films Packaging Thick films Wafer scale integration
This paper reports a new method for the integration of fabrication processes and wafer level packaging of optical MEMS device. The electroplated magnetic thick film was employed to realize the localized heating assisted wafer level package. Due to the solder reflow and electroplating technique, hermetic seal of the packaged device is achieved. In addition, the electroplated thick film also performed as a spacer. In applications, the integration the MUMPs devices with the proposed packaging techniques were demonstrated.

Metrics

1 Record Views

Details

Logo image