- Title
- Interfacial Reaction and Elemental Redistribution in Sn3.0Ag0.5Cu-xPd/ENIG Solder Joints after Aging
- Creators - without role
- I.T. WangJ.G. Duh - 國立清華大學工學院材料科學工程學系C.Y. ChengJ. Wang
- Publication Details
- TMS 2011 Annual Meeting & Exhibition TMS 2011 Annual Meeting & Exhibition
- Identifiers
- 9957766811806774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Interfacial Reaction and Elemental Redistribution in Sn3.0Ag0.5Cu-xPd/ENIG Solder Joints after Aging
TMS 2011 Annual Meeting & Exhibition TMS 2011 Annual Meeting & Exhibition
2011
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