Interfacial Reaction and Mechanical Evaluation in Pd-Containing Solder Joints via Drop and High Speed Impact Test

Conference paper

H. M. Lin, C. Y. Ho, W. L. Chen, Y. H. Wu, D. H. Wang, T. X. Yong, J. R. Lin, Z. W. Lin and J. G. Duh

The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition

2013

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Title: Interfacial Reaction and Mechanical Evaluation in Pd-Containing Solder Joints via Drop and High Speed Impact Test
Creators - without role: H. M. Lin
C. Y. Ho
W. L. Chen
Y. H. Wu
D. H. Wang
T. X. Yong
J. R. Lin
Z. W. Lin
J. G. Duh - 國立清華大學工學院材料科學工程學系
Publication Details: The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition The Minerals, Metals & Materials Society 142th Annual Meeting & Exhibition
Identifiers: 9957768642606774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper