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Interfacial Reaction and Microstructure Variation in the Liquid Reaction of Sn-xAg-Cu Solders on Cu-yZn Substrates
Conference paper

Interfacial Reaction and Microstructure Variation in the Liquid Reaction of Sn-xAg-Cu Solders on Cu-yZn Substrates

C.Y. Yu and J.G. Duh
TMS 2010 139th Annual Meeting & Exhibition TMS 2010 139th Annual Meeting & Exhibition
2010

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