- Title
- Interfacial Reaction between Pure Sn and Cu Substrate with Different Grain Size
- Creators - without role
- J.M. WangK.J. WangJ.G. Duh - 國立清華大學工學院材料科學工程學系
- Identifiers
- 9957771367906774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- TMS 2010 139th Annual Meeting & Exhibition TMS 2010 139th Annual Meeting & Exhibition
Conference paper
Interfacial Reaction between Pure Sn and Cu Substrate with Different Grain Size
TMS 2010 139th Annual Meeting & Exhibition TMS 2010 139th Annual Meeting & Exhibition
2010
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