- Title
- Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder and a Novel UBM Ni-xZn Films in Liquid State
- Creators - without role
- H.M. LinJ.G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- 12th International Conference on Electronic Packaging Technology and High Density Packaging 12th International Conference on Electronic Packaging Technology and High Density Packaging
- Identifiers
- 9957769311906774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder and a Novel UBM Ni-xZn Films in Liquid State
12th International Conference on Electronic Packaging Technology and High Density Packaging 12th International Conference on Electronic Packaging Technology and High Density Packaging
2011
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