- Title
- Interfacial Reaction between Sn solder and Cu-xZn UBM after Reflow and Thermal Aging
- Creators - without role
- C.Y. YuJ.G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- 2009 International Conference on Electronic Packaging Technology & High Density Packaging 2009 International Conference on Electronic Packaging Technology & High Density Packaging
- Identifiers
- 9957771083006774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Interfacial Reaction between Sn solder and Cu-xZn UBM after Reflow and Thermal Aging
2009 International Conference on Electronic Packaging Technology & High Density Packaging 2009 International Conference on Electronic Packaging Technology & High Density Packaging
2009
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