- Title
- Interfacial Reactions and Microstructural Evolution in Sn-37Pb/Electroless Ni/Cu/Al2O3 Joint during Annealing
- Creators - without role
- J. W. LeeJ. H. YehJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Identifiers
- 9957767842906774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- 2003 International Brazing and Soldering Conference 2003 International Brazing and Soldering Conference
Conference paper
Interfacial Reactions and Microstructural Evolution in Sn-37Pb/Electroless Ni/Cu/Al2O3 Joint during Annealing
2003 International Brazing and Soldering Conference 2003 International Brazing and Soldering Conference
2003
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