- Title
- Interfacial Reactions between Ni/Cu UBM and Eutectic Pb-Sn Solder in Flip Chip Technology
- Creators - without role
- C.S. HuangJ.G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- 2002 TMS Annual Meeting & Exhibition 2002 TMS Annual Meeting & Exhibition
- Identifiers
- 9957776345506774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Interfacial Reactions between Ni/Cu UBM and Eutectic Pb-Sn Solder in Flip Chip Technology
2002 TMS Annual Meeting & Exhibition 2002 TMS Annual Meeting & Exhibition
2002
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