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Interfacial toughness evaluation of SAC305 solder bump with pendulum impact test
Conference paper

Interfacial toughness evaluation of SAC305 solder bump with pendulum impact test

F.C. Tai and J.G. Duh
IMPACT Conference 2009 International 3D IC Conference - Proceedings, pp.541-544
2009

Abstract

The high impact speeds (200, 1000 mm/s) in the pendulum test were conducted on the SAC305/ENIG joints aged at 150°C for 500 and 1000 h, respectively. The preliminary results exhibit that the peak force, pre-peak energy and total impact energy except post-energy of as-reflowed are larger than those of as-aged samples regardless of aging time. For the as-reflowed SAC305/ENIG joint (0.3 mm at diameter), the peak force is 2.592 N at the speed of the 1000 mm/s; the impact toughness is 0.168 mJ and the total impact energy is 0.345 mJ. Fracture mode also reveals the typical IMC fracture. ©2009 IEEE.

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