- Title
- Introducing Nanoscale Twins in Cu Metallization for Interconnect Applications
- Creators - without role
- C. N. Liao - 國立清華大學工學院材料科學工程學系
- Publication Details
- IUMRS International Conference in Asia (IUMRS-ICA)
- Identifiers
- 9957766676406774
- Academic Unit
- Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Introducing Nanoscale Twins in Cu Metallization for Interconnect Applications
IUMRS International Conference in Asia (IUMRS-ICA)
2012
Metrics
1 Record Views