- Title
- Investigatig the Stability of Hexagonal-(Cu,Ni)6Sn5 Phase with Doping Ni in Pb-Free Solder Joints via First Principle Simulation
- Creators - without role
- T. T. ChouW. Y. ChenC. FleshmanW. TuC. LeeJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- Materials Science & Technology Conference and Exhibition 2015 Materials Science & Technology Conference and Exhibition 2015
- Identifiers
- 9957766493206774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Investigatig the Stability of Hexagonal-(Cu,Ni)6Sn5 Phase with Doping Ni in Pb-Free Solder Joints via First Principle Simulation
Materials Science & Technology Conference and Exhibition 2015 Materials Science & Technology Conference and Exhibition 2015
2015
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