Investigation of Chip-Interposer Interaction by Loading the Residual Stress of Copper-Filled Through Silicon Via

Conference paper

C. C. Lee and P. C. Huang

2016 International Electron Devices and Materials Symposium (IEDMS) 2016 International Electron Devices and Materials Symposium (IEDMS)

2016

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Title: Investigation of Chip-Interposer Interaction by Loading the Residual Stress of Copper-Filled Through Silicon Via
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
P. C. Huang
Identifiers: 9957766616806774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: 2016 International Electron Devices and Materials Symposium (IEDMS) 2016 International Electron Devices and Materials Symposium (IEDMS)