Investigation of Delamination Mechanism of Cu/Low-k Stacking Structure in Flip Chip Packages

Conference paper

C. C. Chiu, C. J. Huang, S. Y. Yang, C. C. Lee and K. N. Chiang

Materials for Advanced Metallization Conference (MAM 2009) Materials for Advanced Metallization Conference (MAM 2009)

2009

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Title: Investigation of Delamination Mechanism of Cu/Low-k Stacking Structure in Flip Chip Packages
Creators - without role: C. C. Chiu
C. J. Huang
S. Y. Yang
C. C. Lee - 國立清華大學工學院動力機械工程學系
K. N. Chiang
Publication Details: Materials for Advanced Metallization Conference (MAM 2009) Materials for Advanced Metallization Conference (MAM 2009)
Identifiers: 9957773295406774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper