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Investigation of Interconnect Design on Interfacial Cracking Energy of Al/TiN Barriers under a Flexural Load
Conference paper

Investigation of Interconnect Design on Interfacial Cracking Energy of Al/TiN Barriers under a Flexural Load

C. C. Lee, Y. F. Su, C. S. Wu and K. N. Chiang
6th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2012), 6th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms2012),
2012

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